| PART |
Description |
Maker |
| HSM88AS |
MPAK package is suitable for high density surface mounting and high speed assembly
|
TY Semiconductor Co., Ltd
|
| HSB88WA |
CMPAK package is suitable for high density surface mounting and high speed assembly
|
TY Semiconductor Co., Ltd
|
| LTV847 LTV817 |
HIgh Density Mounting Type Photocoupler
|
Lite-On Technology Corporation
|
| BL817S |
High Density Mounting Type Photocoupler
|
SeCoS Halbleitertechnologie GmbH
|
| PC817B PC817C PC827 PC-817 PC817A PC847 PC837 PC81 |
HIGH DENSITY MOUNTING TYPE PHOTOCOUPLER
|
Sharp Electrionic Compo...
SHARP[Sharp Electrionic Components]
Sharp Corporation
|
| BL817S |
High Density Mounting Type Photocoupler
|
SeCoS
|
| PC815 PC815-SERIES |
High Sensitivity, High Density Mounting Type Photocoupler
|
SHARP[Sharp Electrionic Components]
|
| HSU88 |
Ultra small Resin Package (URP) is suitablefor high density surface mounting and high speed assembly
|
TY Semiconductor Co., Ltd
|
| TLP521 |
HIGH DENSITY MOUNTING PHOTOTRANSISTOR OPTICALLY COUPLED ISOLATORS
|
ISOCOM COMPONENTS
|
| ISP815 ISP815X ISP825 ISP845 ISP845X ISP825X |
HIGH DENSITY MOUNTING PHOTODARLINGTON OPTICALLY COUPLED ISOLATORS
|
ISOCOM[ISOCOM COMPONENTS]
|
| IS354 |
HIGH DENSITY MOUNTING AC INPUT, PHOTOTRANSISTOR OPTICALLY COUPLED ISOLATORS
|
Electronic Theatre Controls, Inc.
|
